Photolithography Equipment

Find parts, products, suppliers, datasheets, and more for:Lithography Equipment – Fiber Optic Feedthrough for Lithography Tool

Description: shown is the introduction of a laser into aphotolithographytool used for interferometry measurements. Interferometers are used to accurately control stage movement for the proper positioning of the wafer and reticle stages relative to each other. The need for high accuracy in this area will

Description: AIM grating target is designed to fit CMP design rules, without leaving any large open areas on the printed target. This enables printing a target with high mark fidelity and measurement with higher accuracy. Lithography Increases overall

Measurement Capability: Defects / ADC

Mounting / Loading: Floor Mounted / Stand-alone

Description: processing Provides a 30 percent improvement in precision and 50 percent reduction in TIS variability over previous generation systems Increases overall

effectiveness of lithography cell tools Archer Analyzer real-time, on-tool analysis software provides mission

Maximum Wafer / Part Size: 200 to 300 mm

Measurement Capability: Defects / ADC

Description: fidelity and measurement with higher accuracy. Lithography Increases overall

effectiveness of lithography cell tools. Reliably and accurately measures in exact process conditions for better stepper matching and lithography process control. Wafer Surface Focus and

Measurement Capability: Defects / ADC

Mounting / Loading: Floor Mounted / Stand-alone

Description: Enables control of overlay error budget for sub-0.13-micron production. Provides a 30 percent increase in throughput over previous generation tools. Allows consistent, reliable and robust measurement of low-contrast targets, including STI processing. Increases overall

Maximum Wafer / Part Size: 200 to 300 mm

Measurement Capability: Defects / ADC

Description: ranging from infrared (1064 nm) to deep ultraviolet (266 nm). This innovation facilitates efficient trimming of metals, silicon and ITO as well as open line repair, within a single piece of repair

. The MIC4 is fully compatible with the ATF4, ATF5, and LLC6 linear lens changer

Applications: CVD / PVD Films, Electroplated Films, Packaged ICs / Ceramic Substrates,

Measurement Capability: Defects / ADC, Other

Mounting / Loading: Floor Mounted / Stand-alone

Standards and Technical Documents – Safety Requirements for Machine Tools Using Lasers for Processing Materials – Electronic Copy — ANSI B11.21-2006 (R2012)

Supplier:American Society of Safety Engineers (ASSE)

Description: information provided with such machines. Excluded from the requirements of this document are:photolithography; holography;equipmentused in medical applications; data storage; laser printers; and copiers.

Description: MACOMs fixed attenuator chips are fabricated using our state of the art thin film metallization and advanced

technology. All devices are available in chip form with a metallized ground connection on the back. This ground is wrapped around on the four corners of the chip so

Description: been proven in applications including optics positioning in

, XYZ stage positioning in atomic force microscopy, and spindle position in precision grinding of bearing races.

Measurement Range: 0.0 to 0.0500 inch

Operating Temperature: -67 to 220 F

Description: The Metrigraphics Division of DRC is a leading worldwide supplier of ultra-high, precision, custom components for Original

Manufacturers (OEMs). We have applied our core technologies of electroforming,

, and thin-film sputtering to help customers increase the

Functional / Performance: Conductive, Dielectric

Industry: Electronics, OEM / Industrial

Material / Substrate Capabilities: Aluminum, Ceramic, Composites, Copper / Copper Alloys, Glass, Metal, Nickel / Nickel Alloys, Precious Metals, Plastic, Stainless Steel, Steel / Steel Alloys, Titanium

Regional Preference: North America, United States Only, Northeast US Only

Standards and Technical Documents – Safety of machinery – Laser processing machines – Part 1: General safety requirements — ISO 11553-1:2005

Supplier:IEC – International Electrotechnical Commission

Description: dealing with noise as a hazard from laser processing machines are not included in ISO 11553-1:2005. They will be included in a subsequent amendment. ISO 11553-1:2005 is not applicable to laser products, orequipmentcontaining such products, which are manufactured solely and expressly for the

Standards and Technical Documents – Safety of machinery — Laser processing machines — Part 1: General safety requirements — ISO 11553-1:2005

Supplier:ISO International Organization of Standards

Description: . Requirements dealing with noise as a hazard from laser processing machines are not included in ISO 11553-1:2005. They will be included in a subsequent amendment. ISO 11553-1:2005 is not applicable to laser products, orequipmentcontaining such products, which are manufactured solely and

Description: Advanced composite materials have been used successfully in optomechanical systems since the 1970s. They are being used increasingly in numerous commercial and military applications including: optical benches, telescopes, binoculars, mirrors, metrology and

Technology / Subject: Design / Engineering Methods (ESDU, DFx, etc.), Photonics / Optics

Description: This course provides attendees with an introductory overview on the fabrication methods and applications of polymer based microsystems, including an examination of fabrications methods such as

, LIGA, laser ablation, casting, hot embossing and injection molding. The course

Technology / Subject: Lasers, Nanomaterials / Nanotechnology, Photonics / Optics, Semiconductors / Microelectronics (ICs), Specialty / Other

Description: various production modules of CMOS IC fabrication. The presentation provides a survey of each of the major manufacturing technologies involved in the wafer process flow. These include oxidation, deposition (CVD and PECVD), diffusion, metallization (PVD), ion implant,

Technology / Subject: Nanomaterials / Nanotechnology, Photonics / Optics, Semiconductors / Microelectronics (ICs), Specialty / Other

Description: with standard microscope objectives, these components are ideal for applications requiring high throughput and excellent resolution in the UV or IR, including FTIR spectroscopy, ellipsometry,

, and semiconductor inspection.The objectives feature an infinite conjugate design

Description: with standard microscope objectives, these components are ideal for applications requiring high throughput and excellent resolution in the UV or IR, including FTIR spectroscopy, ellipsometry,

, and semiconductor inspection.The objectives feature an infinite conjugate design

Description: with standard microscope objectives, these components are ideal for applications requiring high throughput and excellent resolution in the UV or IR, including FTIR spectroscopy, ellipsometry,

, and semiconductor inspection.The objectives feature an infinite conjugate design

Description: with standard microscope objectives, these components are ideal for applications requiring high throughput and excellent resolution in the UV or IR, including FTIR spectroscopy, ellipsometry,

, and semiconductor inspection.The objectives feature an infinite conjugate design

Homogenizing Rods for Optical Lithography

known more commonly asPhotolithography; it is a process that involves microfabrication of pattern parts of a thin film or of a bulk substrate. It uses a light source that peaks strongly in the UV region, and this spectrum of light is then filtered through the system to help print using the light(read more)

high precision optical components for 300 mm and 450 mm wafer handling – and even meter-class semiconductorphotolithographystages. These stage components can be
made in a(read more)

Photo etching is a process used in the creation of integrated circuits, that combines

is used to form patterns on semiconductor substrates coated with photoresist, resulting in selective developing of the photo-resist, when exposed

Fabrication of GaAs Devices. Focusing on all aspects of GaAs processing that deal with GaAs free surfaces and interfaces between GaAs and metal contacts or dielectrics, this detailed text offers pragmatic advice on cleaning and passivation, wet and dry etching and

Micro-optical Technology Applied to Joint Implants A transatlantic partnership may provide balm for some weary bones. Empa Swiss Federal Laboratories for (Thun, Switzerland) will use a

system developed in the United States to fabricate implantable devices. Among the anticipated

MICRO:Industry News:Breakout 2 (March 99)

In a spate of recent announcements, several equipment suppliers, semiconductor manufacturers, and research organizations have said they are aggressively pursuing plans to advance

state of the art. Concerted efforts are underway in areas such as electron beam and extreme

Screen Printable Polymers for Wafer Level Packaging: A Technology Assessment (.pdf)

Screen print patterning is an attractive alternative to traditional semiconductor

. Our work compared the pattern resolution and mechanical resistance of screen-printed polymers versus spin-on methods. Optical microscopy of screen-printed coatings reveal sharp edge features as well

Preventing Adhesive Resin Bleed in Microelectronics Assembly through Gas Plasma Technology (.pdf)

Screen print patterning is an attractive alternative to traditional semiconductor

. Our work compared the pattern resolution and mechanical resistance of screen-printed polymers versus spin-on methods. Optical microscopy of screen-printed coatings reveal sharp edge features as well

is a key step in semiconductor manufacturing, and the stepper illumination tool is the most important and expensive element of

. As imaged features decrease in size, steppers utilize light at shorter wavelengths. At shorter wavelengths, stepper optics

of Photochemical Contamination Control for Lithographic Tools. At first, the two professors seemed like an odd couple. But the combination makes perfect sense. Optics contamination, a known concern for space-based instruments, is emerging as a significant risk to

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3.4 Four key semiconductor manufacturing technology transitions (as of 2012)………..42 3.4.1 Background on the current transition to EUV Lithography……………..43 3.4.2 Prior Academic Studies of the Photolithography Equipment Industry……..46 3.4.3 Background on the

Photolithography equipment is the only segment of front-end SME equipment in which U.S. manufacturers do not hold a competitive advantage.

Application of feed-forward and feedback control to a photolithography sequence

In this paper, we describe the implementation of supervi- sory control over three photolithography equipment : a spin- coat and bake track, a stepper and a developer.

Manufacturing Engineering and Process II

The photolithography equipment can be divided into three main parts, that is, scanner, spinner, and developer.

Handbook of Visual Display Technology

For example, generation 8.5 photolithog- raphy equipment occupies approximately 5,800 m2 and weighs approximately 410 t.) Owing to the immense market potential (worldwide LCD panel revenue was approximately US$69 billion in 2009) [1], the drastically different set of technical challenges

P10: A Novel Stitching Design for LargeArea TFTLCD TV

Of those, larger than 40in. size products are developed by applying stitching method for design & process to scanning photolithography equipment .

The worlds first automated reticle handling system using OHT

As a result, photolithography equipments were occasionally left idle by reticlc delivcly delays.

Optimization of lowtemperature polySi TFTLCDs and a largescale production line for large glass substrates

TABLE 6 Comparison of the specifications of each generation of photolithography equipment .

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