Electron

that uses a focused beam of electrons to form the circuit patterns needed for material deposition on (or removal from) the wafer, in contrast withwhich uses light for the same purpose. Electron lithography offers higher patterning resolution than optical lithography because of the shorter wavelength possessed by the 10-50 keV electrons that it employs.

Given the availability of technology that allows a small-diameter focused beam of electrons to be scanned over a surface, an EBL system doesnt need masks anymore to perform its task (unlike optical lithography, which uses photomasks to project the patterns). An EBL system simply draws the pattern over the resist wafer using the electron beam as its drawing pen. Thus, EBL systems produce the resist pattern in a serial manner, making it slow compared to optical systems.

Atypical EBL systemconsists of the following parts: 1) an electron gun or electron source that supplies the electrons; 2) an electron column that shapes and focuses the electron beam; 3) a mechanical stage that positions the wafer under the electron beam; 4) a wafer handling system that automatically feeds wafers to the system and unloads them after processing; and 5) a computer system that controls the equipment.

Figure 1.Example of an electron beam lithography equipment from Jeol

The resolution of optical lithography is limited by diffraction, but this is not a problem for electron lithography. The reason for this is the short wavelengths (0.2-0.5 angstroms) exhibited by the electrons in the energy range that they are being used by EBL systems. However, the resolution of an electron lithography system may be constrained by other factors, such aselectron scatteringin the resist and by variousaberrationsin its electron optics.

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Just like optical lithography, electron lithography also uses positive and negative resists, which in this case are referred to as electron beam resists (ore-beam resists). E-beam resists are e-beam-sensitive materials that are used to cover the wafer according to the defined pattern.

Positive electron resists produce an image that is the same as the pattern drawn by the e-beam (positive image), while negative ones produce the reverse image of the pattern drawn (negative image). Positive resists undergo bond breaking when exposed to electron bombardment, while negative resists form bonds or cross-links between polymer chains under the same situation.

As a result, areas of the positive resist that are exposed to electrons become more soluble in the developer solution, while the exposed areas of the negative resist become less soluble. This is the reason why positive resists form positive images – because its electron-exposed areas will result in exposed areas on the wafer after theyve dissolved in the developer. In the case of negative resists, the electron-exposed areas will become the unexposed areas on the wafer, forming a negative image.

The resolution achievable with any resist is limited by two major factors: 1) the tendency of the resist to swell in the developer solution and 2) electron scattering within the resist.

Resist swellingoccurs as the developer penetrates the resist material. The resulting increase in volume can distort the pattern, to the point that some adjacent lines that are not supposed to touch become in contact with each other.

Resist contractionafter the resist has undergone swelling can also occur during rinsing. However, this contraction is often not enough to bring the resist back to its intended form, so the distortion brought about by the swelling remains even after rinsing. Unfortunately, a swelling/contraction cycle weakens the adhesion of the smaller features of the resist to the substrate, which can create undulations in very narrow lines. Reducing resist thickness decreases the resolution-limiting effects of swelling and contraction.

When electrons strike a material, they penetrate the material and lose energy from atomic collisions. These collisions can cause the striking electrons to scatter, a phenomenon that is aptly known asscattering. The scattering of electrons may be backward ( or back-scattering, wherein electrons bounce back), but it is often forward through small angles with respect to the original path.

During electron beam lithography, scattering occurs as the electron beam interacts with the resist and substrate atoms. This electron scattering has two major effects: 1) itbroadensthe diameter of the incident electron beam as it penetrates the resist and substrate; and 2) it gives the resist unintended extra doses of electron exposure as back-scattered electrons from the substrate bounce back to the resist.

Thus, scattering effects during e-beam lithography result inwiderimages than what can be ideally produced from the e-beam diameter, degrading the resolution of the EBL system. In fact, closely-spaced adjacent lines can add electron exposure to each other, a phenomenon known asproximity effect.

See Also:Lithography/Etch;Optical Lithography;IC Manufacturing;Wafer Fab Equipment

ASML extreme-ultraviolet (EUV) lithography test machines ship

Samsung005935.KS),IntelNASDAQ:INTC),TSMC

Extreme-ultraviolet (EUV) lithography offers some hope in the battle to keep Moores Law relevant. The very short light wavelength that can be leveraged by EUV machines means that they have the capability to create higher resolution surface etchings than ever before, to help make components smaller than ever before. Now, according toMIT Technology Review, viaFudzilla, the first test machines capable of EUV lithography have started to ship, from chipmaking equipment firm ASML, to the likes of Samsung, Intel and others.

Back in 2012 HEXUS reported on Samsung making a considerableinvestmentin Dutch company ASML which seems to be at the forefront in efforts to make EUV lithography practical for mass production. Samsungs cash backing followed even larger investments in ASML by chipmakers like TSMC and Intel.

Progress with EUV seems to have been slow. The problem was that it was difficult to make an EUV light source bright enough for practical industrial lithography processes. ASML has pushed forward with advances in plasma and laser physics and materials science to push past this hurdle. Over recent months it has managed to make the EUV light generator five times more efficient with the knock on effect of faster and more efficient lithographic process. But theres still room for improvement.

Of course ASML must now be feeling confident enough that its EUV machines are capable of impressing, or at least meeting its investors expectations, as test machines have now shipped. Speeds quoted by the MIT Technology Review site suggest the test machines are capable of outputting something like 400 wafers per day. If the EUV light source could be doubled in intensity then up to 800 wafers could be output per machine per day. That is still said to compare unfavourably with status quo technology, capable of 3,000 wafers per day. However that 3,000 figure is expected to drop as more lithographic patterning steps and more expensive masks are required to make ever finer features on future chips without EUV.

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Posted by cheesemp – Tue 12 Apr 2016 12:46Presumably there are more chips per wafer with a size reduction so presumably 800 wafers isnt as bad as it could be?Posted by Kumagawa – Tue 12 Apr 2016 14:49cheesempPresumably there are more chips per wafer with a size reduction so presumably 800 wafers isnt as bad as it could be?Well Nvidias new pascal is 610mm on 16nm physically larger than any chips they made at 28nm so less per wafer than the previous generation.Shrinking chips allows you to make older chips cheaper but if you want performance improvements then the size will either stay the same or get larger.The game consoles will see cost reduction from having smaller chips but phone SoCs/CPUs/GPUs will stay the same in size.MY HEXUS

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How Offset Printing Works

The next time you read your favorite magazine or go through the latest catalog that arrives in your mailbox, stop for a moment and think about how that publication came to be. First, writers, editors and designers participate in the creative process­. Printers take that creative work and turn it into the publications you read every day. Printing is a fascinating process involving huge high-speed machines, 2,000-pound rolls of paper,computers, metal plates, rubber blankets and sharp knives.

Offset lithography, the most commonly used printing process, and detail the three production steps: pre-press, press run and bindery. Well follow the publication of our new magazine,How Stuff Works Express, from start to finish to explore this process.

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Lithography Equipment

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Other Sources of Printing Related Environmental Training

Lithographic printing is well suited for printing both text and illustrations in short to medium length runs of up to 1,000,000 impressions. Typical products printed with offset printing processes include:

General commercial printing Quick printing

Business Forms Financial and Legal Documents

Offset Lithographic Printing Process Overview

Lithography is an offset printing technique. Ink is not applied directly from the printing plate (or cylinder) to the substrate as it is in gravure, flexography and letterpress. Ink is applied to the printing plate to form the image (such as text or artwork to be printed) and then transferred or offset to a rubber blanket. The image on the blanket is then transferred to the substrate (typically paper or paperboard) to produce the printed product.

On sheet-fed presses, the substrate is fed into the press one sheet at a time at a very high speed. Web fed presses print on a continuous roll of substrate, or web, which is later cut to size. There is a total of 3 types of offset printing: non-heatset sheetfed, heatset, and non-heatset web offset. The difference between heatset and non-heatset is primarily dependent on the type of ink and how it is dried.More Information…

Used Printmaking Presses

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Over the 50 plus years of manufacturing and repairing printmaking presses, we have seen and repaired every style of printmaking press from every manufacturer of printmaking presses. Often, we acquire used presses on trade-ins. These used presses range from large floor model presses to small tabletop presses. We acquire a variety of different presses from different manufacturers including etching, lithography, combination, and monotype presses. Once we get a traded-in press, our technicians inspect, test, and rebuild the press. Then we offer it for sale as a used printmaking press. All the used printmaking presses offered by Conrad Machine Co. are in like-new working condition. Every part on the presses is thoroughly examined and tested to insure proper working order before the used press leaves our factory. You can be assured when you buy a used press from Conrad Machine Co., you are getting a used printmaking press that functions as if it were new. We are so confident in our repaired and rebuilt used printmaking presses that we offer warranties on the presses as if they were new.

All new Conrad Machine Co. printmaking presses come with the printmaking industrys leading 25-year warranty. All new presses built by Conrad Machine Co.– including American French Tool, Rembrandt, and Brand New pressesare warranted for the first 25 years of the life of your press against defects in materials and craftsmanship. If anything breaks on you presses due to these reasons, we are happy to repair your press free of charge.

All used printmaking presses that Conrad Machine Co. sells will be properly setup, thoroughly inspected, and rigorously tested to be sure they are in smooth, like-new operating condition before they leave our press factory. Only used presses built by Conrad Machine Co. will carry the printmaking industrys leading 25-year warranty against defects in materials and craftsmanship. This means that if you buy a used Conrad, American French Tool, Rembrandt, or Brand New press from Conrad Machine Co., we will warranty that used press for 25-years as if it were a new press built by Conrad Machine Co. Presses built by other manufacturers, such as Charles Brand Presses, do not carry this extensive, industry leading warranty. Pleasecontact our factoryfor more information about warranty options on used printmaking presses built by other manufacturers.

Many printmakers need to sell their older presses to make room in their studio for their new presses. As you may know, selling your old, large floor model etching or lithography printmaking press on the open market can prove be quite difficult. Potential buyers may not be will to ship the press long distances and you may not have the resources to transport the press yourself. Not to mentionif you find a buyer, you may not be able sell it for what its worth. That is why Conrad Machine Co., looking to help printmakers acquire new presses, accepts traded-in presses toward the purchase of a new press. If you have an older press and would like upgrade or purchase a new press, we will allow you to trade in your old press toward the purchase a new press. Even if your press is broken, we will accept it as a trade-in toward the purchase of a new press. We accept trade-ins on printmaking presses made by any manufacturer– not just presses built by Conrad Machine Co. If you have a press that you would like to trade in toward the purchase of a new press, pleasecontact our factoryfor more details about our trade-in policies.

In some circumstances, Conrad Machine Co. will even buy your used press directly. If you need to make room in your studio or educational institute and have to sell of one of your older presses, Conrad Machine Co. may buy your older press from you. Pleasecontact Conrad Machine Co.for more information about trading in your older presses.

Because we acquire most of the used printmaking presses on trade-ins, we cannot guarantee that we will have any press that you desire at any time. We are constantly acquiring different used presses. If we do not currently have the used press that you are looking for, please come back in a few weeks. Our supply is constantly changing. We may acquire the used press model that you are looking for at a later date. Below is a table of the used presses that we are currently offering. You may click on the press name or the sidebar to visit that press page.

American French Tool Floor Model – (SOLD)

Rebuilt Charles Brand Floor Model (Old Style)

Rebuilt Charles Brand Floor Model (Old Style)

Rebuilt Charles Brand Floor Model (New Style)

Rebuilt Charles Brand Floor Model (Old Style)

Rebuilt Charles Brand Floor Model (Old Style)

Rebuilt Conrad E-18 Standard – (SOLD)

Rebuilt Conrad E-18 Standard – (SOLD)

Rebuilt Conrad Monotype with Geared Drive – (SOLD)

Rebuilt Conrad Floor Model motorized with Gauges

Rebuilt Conrad Floor Model with 25 to 1 hand drive and gauges

Griffin Floor Model Litho Press – (SOLD)

Takach Floor Model Litho Motorized Press

Rebuilt Wright Motorized Combination Press – (SOLD)

Rebuilt Wright Motorized Combination Press

© 2015, Conrad Machine Co. Designed and built by Shaun S. Conrad

Photolithography Equipment

Find parts, products, suppliers, datasheets, and more for:Lithography Equipment – Fiber Optic Feedthrough for Lithography Tool

Description: shown is the introduction of a laser into aphotolithographytool used for interferometry measurements. Interferometers are used to accurately control stage movement for the proper positioning of the wafer and reticle stages relative to each other. The need for high accuracy in this area will

Description: AIM grating target is designed to fit CMP design rules, without leaving any large open areas on the printed target. This enables printing a target with high mark fidelity and measurement with higher accuracy. Lithography Increases overall

Measurement Capability: Defects / ADC

Mounting / Loading: Floor Mounted / Stand-alone

Description: processing Provides a 30 percent improvement in precision and 50 percent reduction in TIS variability over previous generation systems Increases overall

effectiveness of lithography cell tools Archer Analyzer real-time, on-tool analysis software provides mission

Maximum Wafer / Part Size: 200 to 300 mm

Measurement Capability: Defects / ADC

Description: fidelity and measurement with higher accuracy. Lithography Increases overall

effectiveness of lithography cell tools. Reliably and accurately measures in exact process conditions for better stepper matching and lithography process control. Wafer Surface Focus and

Measurement Capability: Defects / ADC

Mounting / Loading: Floor Mounted / Stand-alone

Description: Enables control of overlay error budget for sub-0.13-micron production. Provides a 30 percent increase in throughput over previous generation tools. Allows consistent, reliable and robust measurement of low-contrast targets, including STI processing. Increases overall

Maximum Wafer / Part Size: 200 to 300 mm

Measurement Capability: Defects / ADC

Description: ranging from infrared (1064 nm) to deep ultraviolet (266 nm). This innovation facilitates efficient trimming of metals, silicon and ITO as well as open line repair, within a single piece of repair

. The MIC4 is fully compatible with the ATF4, ATF5, and LLC6 linear lens changer

Applications: CVD / PVD Films, Electroplated Films, Packaged ICs / Ceramic Substrates,

Measurement Capability: Defects / ADC, Other

Mounting / Loading: Floor Mounted / Stand-alone

Standards and Technical Documents – Safety Requirements for Machine Tools Using Lasers for Processing Materials – Electronic Copy — ANSI B11.21-2006 (R2012)

Supplier:American Society of Safety Engineers (ASSE)

Description: information provided with such machines. Excluded from the requirements of this document are:photolithography; holography;equipmentused in medical applications; data storage; laser printers; and copiers.

Description: MACOMs fixed attenuator chips are fabricated using our state of the art thin film metallization and advanced

technology. All devices are available in chip form with a metallized ground connection on the back. This ground is wrapped around on the four corners of the chip so

Description: been proven in applications including optics positioning in

, XYZ stage positioning in atomic force microscopy, and spindle position in precision grinding of bearing races.

Measurement Range: 0.0 to 0.0500 inch

Operating Temperature: -67 to 220 F

Description: The Metrigraphics Division of DRC is a leading worldwide supplier of ultra-high, precision, custom components for Original

Manufacturers (OEMs). We have applied our core technologies of electroforming,

, and thin-film sputtering to help customers increase the

Functional / Performance: Conductive, Dielectric

Industry: Electronics, OEM / Industrial

Material / Substrate Capabilities: Aluminum, Ceramic, Composites, Copper / Copper Alloys, Glass, Metal, Nickel / Nickel Alloys, Precious Metals, Plastic, Stainless Steel, Steel / Steel Alloys, Titanium

Regional Preference: North America, United States Only, Northeast US Only

Standards and Technical Documents – Safety of machinery – Laser processing machines – Part 1: General safety requirements — ISO 11553-1:2005

Supplier:IEC – International Electrotechnical Commission

Description: dealing with noise as a hazard from laser processing machines are not included in ISO 11553-1:2005. They will be included in a subsequent amendment. ISO 11553-1:2005 is not applicable to laser products, orequipmentcontaining such products, which are manufactured solely and expressly for the

Standards and Technical Documents – Safety of machinery — Laser processing machines — Part 1: General safety requirements — ISO 11553-1:2005

Supplier:ISO International Organization of Standards

Description: . Requirements dealing with noise as a hazard from laser processing machines are not included in ISO 11553-1:2005. They will be included in a subsequent amendment. ISO 11553-1:2005 is not applicable to laser products, orequipmentcontaining such products, which are manufactured solely and

Description: Advanced composite materials have been used successfully in optomechanical systems since the 1970s. They are being used increasingly in numerous commercial and military applications including: optical benches, telescopes, binoculars, mirrors, metrology and

Technology / Subject: Design / Engineering Methods (ESDU, DFx, etc.), Photonics / Optics

Description: This course provides attendees with an introductory overview on the fabrication methods and applications of polymer based microsystems, including an examination of fabrications methods such as

, LIGA, laser ablation, casting, hot embossing and injection molding. The course

Technology / Subject: Lasers, Nanomaterials / Nanotechnology, Photonics / Optics, Semiconductors / Microelectronics (ICs), Specialty / Other

Description: various production modules of CMOS IC fabrication. The presentation provides a survey of each of the major manufacturing technologies involved in the wafer process flow. These include oxidation, deposition (CVD and PECVD), diffusion, metallization (PVD), ion implant,

Technology / Subject: Nanomaterials / Nanotechnology, Photonics / Optics, Semiconductors / Microelectronics (ICs), Specialty / Other

Description: with standard microscope objectives, these components are ideal for applications requiring high throughput and excellent resolution in the UV or IR, including FTIR spectroscopy, ellipsometry,

, and semiconductor inspection.The objectives feature an infinite conjugate design

Description: with standard microscope objectives, these components are ideal for applications requiring high throughput and excellent resolution in the UV or IR, including FTIR spectroscopy, ellipsometry,

, and semiconductor inspection.The objectives feature an infinite conjugate design

Description: with standard microscope objectives, these components are ideal for applications requiring high throughput and excellent resolution in the UV or IR, including FTIR spectroscopy, ellipsometry,

, and semiconductor inspection.The objectives feature an infinite conjugate design

Description: with standard microscope objectives, these components are ideal for applications requiring high throughput and excellent resolution in the UV or IR, including FTIR spectroscopy, ellipsometry,

, and semiconductor inspection.The objectives feature an infinite conjugate design

Homogenizing Rods for Optical Lithography

known more commonly asPhotolithography; it is a process that involves microfabrication of pattern parts of a thin film or of a bulk substrate. It uses a light source that peaks strongly in the UV region, and this spectrum of light is then filtered through the system to help print using the light(read more)

high precision optical components for 300 mm and 450 mm wafer handling – and even meter-class semiconductorphotolithographystages. These stage components can be
made in a(read more)

Photo etching is a process used in the creation of integrated circuits, that combines

is used to form patterns on semiconductor substrates coated with photoresist, resulting in selective developing of the photo-resist, when exposed

Fabrication of GaAs Devices. Focusing on all aspects of GaAs processing that deal with GaAs free surfaces and interfaces between GaAs and metal contacts or dielectrics, this detailed text offers pragmatic advice on cleaning and passivation, wet and dry etching and

Micro-optical Technology Applied to Joint Implants A transatlantic partnership may provide balm for some weary bones. Empa Swiss Federal Laboratories for (Thun, Switzerland) will use a

system developed in the United States to fabricate implantable devices. Among the anticipated

MICRO:Industry News:Breakout 2 (March 99)

In a spate of recent announcements, several equipment suppliers, semiconductor manufacturers, and research organizations have said they are aggressively pursuing plans to advance

state of the art. Concerted efforts are underway in areas such as electron beam and extreme

Screen Printable Polymers for Wafer Level Packaging: A Technology Assessment (.pdf)

Screen print patterning is an attractive alternative to traditional semiconductor

. Our work compared the pattern resolution and mechanical resistance of screen-printed polymers versus spin-on methods. Optical microscopy of screen-printed coatings reveal sharp edge features as well

Preventing Adhesive Resin Bleed in Microelectronics Assembly through Gas Plasma Technology (.pdf)

Screen print patterning is an attractive alternative to traditional semiconductor

. Our work compared the pattern resolution and mechanical resistance of screen-printed polymers versus spin-on methods. Optical microscopy of screen-printed coatings reveal sharp edge features as well

is a key step in semiconductor manufacturing, and the stepper illumination tool is the most important and expensive element of

. As imaged features decrease in size, steppers utilize light at shorter wavelengths. At shorter wavelengths, stepper optics

of Photochemical Contamination Control for Lithographic Tools. At first, the two professors seemed like an odd couple. But the combination makes perfect sense. Optics contamination, a known concern for space-based instruments, is emerging as a significant risk to

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3.4 Four key semiconductor manufacturing technology transitions (as of 2012)………..42 3.4.1 Background on the current transition to EUV Lithography……………..43 3.4.2 Prior Academic Studies of the Photolithography Equipment Industry……..46 3.4.3 Background on the

Photolithography equipment is the only segment of front-end SME equipment in which U.S. manufacturers do not hold a competitive advantage.

Application of feed-forward and feedback control to a photolithography sequence

In this paper, we describe the implementation of supervi- sory control over three photolithography equipment : a spin- coat and bake track, a stepper and a developer.

Manufacturing Engineering and Process II

The photolithography equipment can be divided into three main parts, that is, scanner, spinner, and developer.

Handbook of Visual Display Technology

For example, generation 8.5 photolithog- raphy equipment occupies approximately 5,800 m2 and weighs approximately 410 t.) Owing to the immense market potential (worldwide LCD panel revenue was approximately US$69 billion in 2009) [1], the drastically different set of technical challenges

P10: A Novel Stitching Design for LargeArea TFTLCD TV

Of those, larger than 40in. size products are developed by applying stitching method for design & process to scanning photolithography equipment .

The worlds first automated reticle handling system using OHT

As a result, photolithography equipments were occasionally left idle by reticlc delivcly delays.

Optimization of lowtemperature polySi TFTLCDs and a largescale production line for large glass substrates

TABLE 6 Comparison of the specifications of each generation of photolithography equipment .

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Global Lithography Machine Market 2017 Industry Research Report

Global Lithography Machine Market 2017

Global Lithography Machine Market 2017 Industry Research Report

This report studies Lithography Machine in Global market, especially in North America, China, Europe, Southeast Asia, Japan and India, with production, revenue, consumption, import and export in these regions, from 2012 to 2016, and forecast to 2022. This report focuses on top manufacturers in global market, with production, price, revenue and market share for each manufacturer, covering A

Table of Contents Global Lithography Machine Market Professional Survey Report 2017 1 Industry Overview of Lithography Machine 1.1 Definition and Specifications of Lithography Machine 1.1.1 Definition of Lithography Machine 1.1.2 Specifications of Lithography Machine 1.2 Classification of Lithography Machine 1.2.1 Contact Printing Lithography 1.2.2

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Sony Profit Forecast Reaches Record Levels Due to Playstation 4 Popularity

The Sony profit forecast for the year to March, 2018, has rebounded from precious disappointing results. The Japanese electronics company has announced its expectation to achieve record annual profits. The popularity of the Playstation 4 gaming console was particularly emphasized as a major reason for this. Sony has f […]

A Kobe Steel scandal over the falsification of safety data has hit the company hard. The Kobe Steel profit forecast has been scrapped. The Japanese steel company withdrew its profit forecast for the year because the costs of its data falsification activities are not yet fully known. Its interim dividend is also to be c […]

UK car production was down 4% in September, the probable cause being given as Brexit uncertainty. This was in spite of a general growth in Britains manufacturing industry. The Markit/CIPS purchasing managers index (PMI) for July, August and September were 55.3, 56.9 and 55.9 respectively. While Septembers figu […]

Is the US economy about to slow down? According to French investment bank Natixis it is starting from next year. According to Natixis chief economist, Patrick Artus, there will shortly be a significant slowing down of the US economy. What is the evidence for this, and how will this slowdown take shape? […]

The Hong Kong stock exchange closes today after 31 years of trading. The closure is the price paid for the rapid rise in internet and electronic trading. Hong Kong is highly unlikely to be the last stock exchange to become redundant.  As increasing amounts of trading are carried out online, the old stock exchange floo […]

Global Offset Lithography Machine Market Research Report Forecast 2017 to 2021

Global Hot Embossing Lithography Market 2017 Industry Research Report

Global X-ray Lithography Equipments Industry Market Research Report

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Market.Biz is designed to provide the best and most penetrating research required to all commercial, industrial and profit-making ventures in any sector of online business. [Read More …]

Intel Orders 15 EUV Lithography Systems

Designing a DC/DC converter in-house

Is probably not what you think it is. At first glance circuit design seems simple

Intel Orders 15 EUV Lithography Systems

Chip manufacturing equipment supplier ASML Holding NV has received an order for 15 extreme ultraviolet (EUV) lithography systems from an unnamed U.S. customer. The order could be worth in excess of $1 billion.

The customer is almost certainly Intel, one of few global chip manufacturers contemplating the use of EUV lithography for possible insertion at the 10nm or 7nm manufacturing process nodes.

While ASML did not name the customer,Len Jelinek, senior director of semiconductor manufacturing at IHS Technology, says, the tools are for Intel. Intel is preparing for 10nm manufacturing and the use of EUV will allow them to get back on the cost-reduction part of Moores Law, Jelinek says.

Current expectation for EUVL production insertion. Source: ASML.

Intel (Santa Clara, Calif.) did not immediately respond to request for comment on the EUV tool order.

The EUV systems will be used to support increased development activity and pilot production of chips, with delivery of the first two NXE:3350B systems expected before the end of 2015, saysASML(Veldhoven, the Netherlands) in astatement. The tool supplier adds that the new tools will be in addition to existing EUV development systems already with the customeranother clue that points to Intel, one of three chip vendors that has invested in ASML to help fund EUV development.

Deliveries of the orders are likely to be spread into 2016 and even into 2017, but they represent a significant vote of confidence in a technology that has been under research since the mid-1980s and under development since the late 1990s.

Jelinek says Intel engineers have been able to do additional engineering to improve EUV lithography productivity. Intel has been able to modify the tools in order to optimize performance and achieve throughput in excess of 100 wafers per hour. This clearly offers cost advantages over double- or triple-pattern processes, Jelinek says.

While source power has been the No. 1 concern facing EUV lithography due to its impact on productivity, progress is also needed in mask infrastructure, resists, pellicles and inspection.

But technical progress with EUV has started to get on a roll in recent months. Late in 2014, foundry Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) ordered two NXE:3350B EUV lithography systems for production use that are expected to be delivered in 2015.

In February, ASML and TSMC announced that TSMC had exposed 1,000 wafers on an NXE:3350B system in one day. This level of productivity was a marked improvement from the previous high of 500 wafer exposures per day in endurance tests just three months earlier.3350B EUV lithography system being prepared for shipping in mid-2015 with high-power laser and in-situ collector cleaning. Source: ASML.

During a conference call with financial analysts held on April 15, ASML CEO Peter Wennink, said the overall target for 2015 was production of 1,000 wafers per day with 70% availability, moving to 1,500 wafers per day and 85% availability.

The recent progress in EUV may have resulted from a commitment to the technology that was financially engineered by ASMLs previous CEO, Eric Meurice.

In 2012, when progress on EUV appeared to be slowing, Meurice persuaded ASMLs three leading customersIntel, Samsung and TSMCto participate in a co-investment program. Under the program, the three firms are contributing 1.38 billion (about $1.5 billion) to the cost of R&D over five years.

Separately, each of the three companies took minority stakes in ASML totalling 23% in aggregate. Intel agreed to take a 15% stake, with Samsung and TSMC taking smaller stakes.

In October 2012, ASML announced it would acquire a leading developer of EUV lithography light sources, Cymer Inc. (San Diego), for $2.6 billion in cash and stock.

EUV is now approaching volume introduction, Wennik says. Long-term EUV planning and EUV ecosystem preparation is greatly supported by this commitment to EUV, kick-starting a new round of innovation in the semiconductor industry.

An NXE:3350B EUV lithography system is reportedly priced at around 70 million (about $75 million), which would value the 15-tool order at roughly $1.1 billion. But ASML did not disclose the financial terms of the deal.

Peter WenninkWennink says ASML expects to deliver four NXE:3350Bs in 2015 in addition to two already on order. With Intel and TSMC already down for two of the leading-edge machines each, its possible that Samsung is also expected to confirm an order for the machine.

In order to deal with this demand, we are developing a production plan for 2016 of one EUV system per month, supporting a ramp-up to a 24-system manufacturing plan for 2017, and doubling that again in 2018, Wennink says.

If EUV lithography cannot be economically used in production, chipmakers only alternative is to make 7nm using the existing technologymultiple patterning using 193nm immersion. Wennink called 7nm multiple patterning with immersionindeed a costly propositiona web of pain that customers are trying to avoid.

In its financial results for the first quarter of 2015, ASML announced net income of 403 million (about $432 million) on sales of 1.650 billion (about $1.77 billion), up 18.1 percent on sales in the same quarter a year before. The company says the outlook for the second quarter is for sales of about 1.6 billion.

Questions or comments on this story? Contact:peter.

IHS semiconductor manufacturing research

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